SN74LVC2G17DBVR
Manufacturer
Model
SN74LVC2G17DBVR
Category
The SN74LVC2G17DBVR is a cost-effective SOT-23-6 logic buffer optimized for low-voltage digital circuits, offering signal buffering and level shifting in compact packages. It supports industrial temperature ranges with 3mA output current and 1.65-5.5V operation, making it suitable for IoT devices, sensor interfaces, and automation systems. Proper thermal management and antistatic handling are critical to prevent failure, while its competitive pricing and stock availability enhance market appeal for mid-scale production.
Reference Pricing
Reference Stock
Specifications
| Bandwidth | Not specified |
| Operating Temperature Range | -40~+125°C |
| Output Current | +/-24mA |
| Output Voltage | 1.65V to 5.5V |
| Package Type | SOT-23-6 |
| Power Dissipation | Not specified |
| Power Supply Rejection Ratio | Not specified |
| Rated Voltage | 1.65V to 5.5V |
| Temperature Drift | Not specified |
Function And Role
Core Function
Signal buffering, level shifting, and logic gate functionality in low-voltage digital circuits
Key Characteristics
- SOT-23-6 package (6-pin surface-mount package)
- Supports 1.65V to 5.5V operating voltage
- 3mA output current
- Low power consumption (typically 10µA quiescent current)
- ROHS compliant
Application Domains
Basic Scenarios
- Microcontroller I/O expansion
- Sensor signal conditioning
- Low-voltage digital interface bridging
Extended Scenarios
- Industrial automation control systems
- Wireless communication modules
- Power management circuits
Precautions
| Soldering | Use 300°C peak temperature with 10-15s soldering time per pad |
| Current Limit | Max continuous output current 3mA (5mA peak for 10ms) |
| Voltage Limit | Absolute maximum supply voltage ±0.5V beyond specified range |
| Thermal Management | Thermal resistance 40°C/W (keep junction temperature below 85°C) |
| Storage | Store in antistatic bags below 10°C and 90% relative humidity |
| Risk Warnings |
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Alternative Model Params
- Voltage range compatibility
- Output drive strength
- Package dimensions
- Temperature range (-40°C to +125°C)
Design Recommendations
| Layout | Maintain 10mil trace spacing for signal integrity |
| Thermal | Use copper pour for heat dissipation |
| Compatibility | Ensure 3.3V/5V system voltage matching |
| Testing | Verify propagation delay (<10ns) with JESD-22-A114F |
Market Positioning
| Strengths |
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| Weaknesses |
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