SSH-003T-P0.2-H
Manufacturer
Model
SSH-003T-P0.2-H
Category
JST SSH-003T-P0.2-H provides a compact, ROHS-compliant housing contact solution for 28-32 AWG wire connections. Its Phosphor Bronze/Tin-plated contacts and 0.4-0.8mm insulation balance electrical performance with mechanical durability, making it suitable for consumer electronics, automotive, and industrial applications. Optimal performance requires controlled soldering (300°C/3-5s), thermal derating above 85°C, and moisture-free storage. Alternatives must match wire gauge, plating, and insulation parameters for functional equivalence.
Reference Pricing
Reference Stock
Specifications
Color | Natural |
Contact Resistance | To be supplemented |
Current Carrying Capacity | To be supplemented |
Dimensions | To be supplemented |
Insulation Resistance | To be supplemented |
Material | Glass-filled PBT, UL94V-0, natural |
Mechanical Strength | To be supplemented |
Operating Temperature Range | To be supplemented |
Rated Voltage | To be supplemented |
Terminal Type | Not specified |
Voltage Rating | To be supplemented |
Weight | To be supplemented |
Function And Role
Core Function
Housing contact for electrical connections in connectors
Key Characteristics
- Wire gauge range: 28~32 AWG (0.032~0.08 mm²)
- Phosphor Bronze contact material with Tin plating
- Insulation outer diameter: 0.4mm~0.8mm
- ROHS compliant
Application Domains
Basic Scenarios
- Consumer electronics connectors
- Automotive interconnects
- Industrial equipment wiring
Extended Scenarios
- Medical device connectivity
- Robotics component interlocks
- Renewable energy system controls
Precautions
Soldering | Maintain 300°C peak temperature for 3-5 seconds; avoid prolonged exposure |
Current Limit | Max 3A continuous current (derate to 50% for high-temperature environments) |
Voltage Limit | Working voltage up to 50V DC/AC |
Thermal Management | Thermal resistance 0.15W/(W·cm²) at 85°C ambient |
Storage | Store in <10% relative humidity; avoid static discharge areas |
Risk Warnings |
|
Alternative Model Params
- Wire gauge (AWG/mm²)
- Contact material/plating
- Insulation diameter
- Reference series compatibility (SH/APSH)
- Thermal resistance
Design Recommendations
Layout | Use 0.5mm spacing between adjacent contacts |
Thermal | Implement 10°C temperature rise above ambient during operation |
Compatibility | Ensure PCB pad dimensions match 0.8mm x 1.2mm footprint |
Testing | Perform 5000 cycle life tests for durability validation |
Market Positioning
Strengths |
|
Weaknesses |
|
Datasheet
Assist inquiry
Distributors

Chuangxinwei Electronic (Shenzhen) Co., Ltd.

Shenzhen JiYuanTong Electronic Co., Ltd.

Shenzhen Hongkai Xuan Technology Co., Ltd.

Shenzhen Chengkai Electronic Co., Ltd.

Shenzhen Aotongxin Shi Ji Diànzǐ Yǒuxiàn Gōngsī

Shenzhen Bingcheng Technology Co., Ltd.

Shenzhen 8:30 Electronics Co., Ltd.

Shenzhen Shangheng Technology Co., Ltd.

Chengze Electronics (Beijing) Co., Ltd.

Shenzhen BoXinFa Technology Co., Ltd.

Braiic Technology (Shenzhen) Co., Ltd.

Shenzhen Chengyan Intelligence Technology Co., Ltd.

Shenzhen Songye Da Technology Co., Ltd.

Shenzhen Chaolongye Electronic Technology Co., Ltd.

Shenzhen Futian District Xinboyuan Electronic Trading Department

Shenzhen Futian District Dongyu Electronic Merchants

Shenzhen Ezze Electronics Co., Ltd.

Shenzhen Gaotai Trading Co., Ltd.

Shenzhen Lika Technology Co., Ltd.

Guangzhou Bestest Electronics Co., Ltd.

Shenzhen SiLian Mei Electronic Co., Ltd.

Shenzhen Haoruida Electronic Operation Department (Individual)

Shenzhen Hengdi Technology Co., Ltd.

Shenzhen Enrant Electronics Co., Ltd.

Shenzhen Ruikin Technology Co., Ltd.

Shenzhen Honglixin Electronic Co., Ltd.

Shenzhen Hamannni Electronic Co., Ltd.

Shenzhen He Rui Da Electronic Trading Co., Ltd. (Individual Proprietorship)

Shenzhen Huangshengda Technology Co., Ltd.

Shenzhen Meidafeng Technology Co., Ltd.