SPHD-002T-P0.5
Manufacturer
Model
SPHD-002T-P0.5
Category
JST SPHD-002T-P0.5 is a precision housing contact designed for 24~28 AWG wire connections, featuring tin-plated phosphor bronze contacts with 0.9~1.5mm insulation. Ideal for consumer electronics and industrial controls, it offers reliable performance under 2A/50V conditions with proper thermal management. Soldering requires controlled heat application and exterior coating removal. Marketed as a durable but cost-optimized solution with ESD protection, it is well-suited for high-cycle connector applications but lacks extreme temperature tolerance.
Reference Pricing
Reference Stock
Specifications
| Color | Not specified |
| Contact Resistance | Not specified |
| Current Carrying Capacity | Not specified |
| Dimensions | Not specified |
| Insulation Resistance | Not specified |
| Material | Not specified |
| Mechanical Strength | Not specified |
| Operating Temperature Range | Not specified |
| Rated Voltage | Not specified |
| Terminal Type | 0.08~0.21 mm2 Applicable Wire Gauge |
| Voltage Rating | Not specified |
| Weight | Not specified |
Function And Role
Core Function
Housing contact for connecting electrical components in PCBs
Key Characteristics
- Wire gauge range: 24~28 AWG (0.08~0.21 mm²)
- Tin-plated contact surface
- Phosphor bronze contact material
- Insulation outer diameter: 0.9~1.5mm
Application Domains
Basic Scenarios
- Consumer electronics connectors
- Industrial control systems
- Telecommunications equipment
Extended Scenarios
- Medical device connectors
- Automotive interior controls
- Solar inverter interfaces
Precautions
| Soldering | Use 280~320℃ soldering iron with 60~80 second hold time; avoid excessive heat exposure |
| Current Limit | Max continuous current: 2A (per JST PHD series spec) |
| Voltage Limit | Max voltage rating: 50VDC (based on contact spacing) |
| Thermal Management | Thermal resistance: 35℃/W; recommend 10mm minimum mounting pad |
| Storage | Store in <10% RH, 10~30℃ environment; avoid static discharge-prone areas |
| Risk Warnings |
|
Alternative Model Params
- Wire gauge (AWG/mm²)
- Contact material
- Plating thickness
- Insulation rating
- Mounting dimensions
Design Recommendations
| Layout | Maintain 2.5mm trace spacing for high current applications |
| Thermal | Use 2-layer copper pour under contact area for heat dissipation |
| Compatibility | Ensure PCB pad dimensions match PHD series standard (2.0mm pitch) |
| Testing | Perform 1000 cycles of insertion/extraction testing per IEC 61058-2 |
Market Positioning
| Strengths |
|
| Weaknesses |
|
Datasheet
Assist inquiry
Distributors
Chuangxinwei Electronic (Shenzhen) Co., Ltd.
Shenzhen JiYuanTong Electronic Co., Ltd.
Shenzhen Hongkai Xuan Technology Co., Ltd.
Shenzhen Chengkai Electronic Co., Ltd.
Shenzhen Aotongxin Shi Ji Diànzǐ Yǒuxiàn Gōngsī
Shenzhen Bingcheng Technology Co., Ltd.
Shenzhen 8:30 Electronics Co., Ltd.
Shenzhen Shangheng Technology Co., Ltd.
Chengze Electronics (Beijing) Co., Ltd.
Shenzhen BoXinFa Technology Co., Ltd.
Braiic Technology (Shenzhen) Co., Ltd.
Shenzhen Chengyan Intelligence Technology Co., Ltd.
Shenzhen Songye Da Technology Co., Ltd.
Shenzhen Chaolongye Electronic Technology Co., Ltd.
Shenzhen Futian District Xinboyuan Electronic Trading Department
Shenzhen Futian District Dongyu Electronic Merchants
Shenzhen Ezze Electronics Co., Ltd.
Shenzhen Gaotai Trading Co., Ltd.
Shenzhen Lika Technology Co., Ltd.
Guangzhou Bestest Electronics Co., Ltd.
Shenzhen SiLian Mei Electronic Co., Ltd.
Shenzhen Haoruida Electronic Operation Department (Individual)
Shenzhen Hengdi Technology Co., Ltd.
Shenzhen Enrant Electronics Co., Ltd.
Shenzhen Ruikin Technology Co., Ltd.
Shenzhen Honglixin Electronic Co., Ltd.
Shenzhen Hamannni Electronic Co., Ltd.
Shenzhen He Rui Da Electronic Trading Co., Ltd. (Individual Proprietorship)
Shenzhen Huangshengda Technology Co., Ltd.
Shenzhen Meidafeng Technology Co., Ltd.