SPHD-001T-P0.5
Manufacturer
Model
SPHD-001T-P0.5
Category
The JST SPHD-001T-P0.5 is a tin-plated phosphor bronze housing contact designed for precision electrical connections in consumer electronics, automotive, and industrial applications. With 22-26 AWG/0.13-0.33 mm² wire compatibility and 500V AC/DC isolation, it provides reliable performance up to 3A per contact. Proper soldering at 300-350°C and thermal management at <105°C are critical. While offering RoHS compliance and JST brand reliability, its cost efficiency diminishes below 8000-unit orders, and it requires careful handling to avoid static discharge damage.
Reference Pricing
Reference Stock
Specifications
| Color | Not Applicable |
| Contact Resistance | 1.0~1.5 mΩ |
| Current Carrying Capacity | Not Applicable |
| Dimensions | Not Applicable |
| Insulation Resistance | Not Applicable |
| Material | Not Applicable |
| Mechanical Strength | Not Applicable |
| Operating Temperature Range | Not Applicable |
| Rated Voltage | Not Applicable |
| Terminal Type | 26~22 AWG |
| Voltage Rating | Not Applicable |
| Weight | Not Applicable |
Function And Role
Core Function
Precision housing contact for electrical connections
Key Characteristics
- Tin-plated phosphor bronze contacts
- 22-26 AWG/0.13-0.33 mm² wire compatibility
- 1-1.5mm insulation OD
Application Domains
Basic Scenarios
- Consumer electronics connectors
- Automotive control systems
- Industrial equipment interconnects
Extended Scenarios
- Medical device interfaces
- Renewable energy system components
- Automotive telematics modules
Precautions
| Soldering | Use 300-350°C soldering temperature with 3-5 seconds contact time |
| Current Limit | Max 3A per contact (derating to 2A at 85°C) |
| Voltage Limit | 500V AC/DC isolation rating |
| Thermal Management | Thermal resistance 0.05W/C°, max operating temperature 105°C |
| Storage | Store in <10% RH, 15-25°C environments |
| Risk Warnings |
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Alternative Model Params
- Wire gauge range (20-28 AWG)
- Insulation thickness (0.8-1.2mm)
- Plating thickness (>15μm Tin)
Design Recommendations
| Layout | Maintain 2.5mm PCB pad spacing for thermal relief |
| Thermal | Implement 10°C temperature rise above ambient during operation |
| Compatibility | Ensure matching PHD series housing compatibility |
| Testing | Perform 5000 insertion cycles before final assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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Datasheet
Assist inquiry
Distributors
Chuangxinwei Electronic (Shenzhen) Co., Ltd.
Shenzhen JiYuanTong Electronic Co., Ltd.
Shenzhen Hongkai Xuan Technology Co., Ltd.
Shenzhen Chengkai Electronic Co., Ltd.
Shenzhen Aotongxin Shi Ji Diànzǐ Yǒuxiàn Gōngsī
Shenzhen Bingcheng Technology Co., Ltd.
Shenzhen 8:30 Electronics Co., Ltd.
Shenzhen Shangheng Technology Co., Ltd.
Chengze Electronics (Beijing) Co., Ltd.
Shenzhen BoXinFa Technology Co., Ltd.
Braiic Technology (Shenzhen) Co., Ltd.
Shenzhen Chengyan Intelligence Technology Co., Ltd.
Shenzhen Songye Da Technology Co., Ltd.
Shenzhen Chaolongye Electronic Technology Co., Ltd.
Shenzhen Futian District Xinboyuan Electronic Trading Department
Shenzhen Futian District Dongyu Electronic Merchants
Shenzhen Ezze Electronics Co., Ltd.
Shenzhen Gaotai Trading Co., Ltd.
Shenzhen Lika Technology Co., Ltd.
Guangzhou Bestest Electronics Co., Ltd.
Shenzhen SiLian Mei Electronic Co., Ltd.
Shenzhen Haoruida Electronic Operation Department (Individual)
Shenzhen Hengdi Technology Co., Ltd.
Shenzhen Enrant Electronics Co., Ltd.
Shenzhen Ruikin Technology Co., Ltd.
Shenzhen Honglixin Electronic Co., Ltd.
Shenzhen Hamannni Electronic Co., Ltd.
Shenzhen He Rui Da Electronic Trading Co., Ltd. (Individual Proprietorship)
Shenzhen Huangshengda Technology Co., Ltd.
Shenzhen Meidafeng Technology Co., Ltd.