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SN74LVC1G14DBVR

Manufacturer

WG (Weigong)

Model

SN74LVC1G14DBVR

Category

special_communication_devices
communication_chips

The TWGMC SN74LVC1G14DBVR is a compact logic inverter, implemented in SOT-23-5 package for low power consumption (10mW) and fast response (10ns), suitable for wearable devices, IoT sensors, and other scenarios that require optimized space and power consumption, but attention must be paid to operating voltage limitations and static protection requirements.

Reference Pricing

10+ :$0.0434
100+ :$0.0336
300+ :$0.0308
3000+ :$0.028
6000+ :$0.0224
9000+ :$0.0252

Reference Stock

Available:Unknown

Specifications

Input impedanceNot specified
Operating temperature range-65℃ to 150℃
Output current±50mA
Package typeDBV/DRL/YZP/DCK DRP/DSF/DPW
Power dissipationlcc-0.1uA
Propagation delay0.9ns-11ns
Supply voltage1.65V-5.5V

Function And Role

Core Function

Logic inversion and signal processing

Key Characteristics

  • SOT-23-5 package
  • Low power design
  • Compliant with RoHS standard
  • Supports 3.3V and 5V power supply

Application Domains

Basic Scenarios

  • Digital circuit signal inversion
  • Microcontroller peripheral circuit

Extended Scenarios

  • Power management for wearable devices
  • Signal conditioning for IoT sensors
  • Low power control units for battery-powered devices

Precautions

Soldering

Reflow soldering process required to avoid overheating and damage to SOT-23-5 package

Current Limit

Maximum continuous current ≤4mA

Voltage Limit

Operating voltage range 2.0-5.5V

Thermal Management

Power dissipation ≤10mW, junction temperature must be kept below 85℃

Storage

Moisture sensitivity level 1, must be stored in a dry environment

Risk Warnings
  • Static discharge may cause permanent damage
  • High temperature (>85℃) environment will reduce performance

Alternative Model Params

  • Voltage compatibility (2.0-5.5V)
  • Package type (SOT-23-5)
  • Logic level (3.3V/5V)
  • Transmission delay (≤10ns)

Design Recommendations

Layout

Recommended to use compact PCB layout, maintain pin spacing ≥1.5mm

Thermal

Additional thermal copper foil is required in high-density PCB design

Compatibility

Must be compatible with logic chips of the same series (e.g., SN74LVC1G00DBVR)

Testing

Signal integrity testing is recommended to verify rise time at 1MHz frequency

Market Positioning

Strengths
  • High cost-effectiveness (starting at $0.025 per unit)
  • Ultra-small package suitable for space-limited scenarios
  • Wide compatibility with mainstream 3.3V/5V systems
Weaknesses
  • Lacks industrial temperature support (-40℃~+85℃)
  • Bulk purchase requires a minimum order quantity of 3000
  • Overseas inventory turnover cycle of 3 days

Datasheet

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