FS8205A
Manufacturer
Model
FS8205A
Category
The FS8205A is a compact SOT-23-6 MOSFET optimized for low-power switching applications requiring high efficiency in space-constrained environments. With a 20V rating, 25mΩ RDS(on), and 3A continuous current, it suits IoT devices and motor control circuits. Thermal management demands careful PCB layout with copper pours, while soldering requires precise reflow profiles. The component's strengths lie in cost efficiency, compact size, and stock availability, but engineers should note its limited thermal cycling performance and lack of integrated protection features.
Reference Pricing
Reference Stock
Specifications
| Drain Current (Id) | 9A |
| Drain-Source Voltage (Vds) | 20V |
| Gate-Source Voltage (Vgs) | ±12V |
| On-Resistance (Rds(on)) | 25mΩ@2.5V |
| Operating Temperature Range | -55~+150℃ |
| Package Material | Not specified |
| Package Type | SOT-23-6 |
| Rated Voltage | 20V |
| Switching Speed | Not specified |
| Threshold Voltage (Vth) | 0.5V |
| Transconductance (gm) | 9S |
Function And Role
Core Function
Low-power switching MOSFET designed for compact electronic circuits
Key Characteristics
- 20V drain-source voltage
- 25mΩ@2.5V on-resistance
- 3A continuous drain current
- 500mV gate threshold voltage
- 1.5W power dissipation
- SOT-23-6 package
Application Domains
Basic Scenarios
- Low-power IoT devices
- Motor control circuits
- Power supply management
Extended Scenarios
- Automotive electronic systems
- Industrial automation equipment
- Consumer electronics with strict size constraints
Precautions
| Soldering | Use 2-3 second reflow soldering with 240-260℃ profile |
| Current Limit | Continuous drain current not to exceed 3A |
| Voltage Limit | Absolute maximum Vdss should not exceed 20V |
| Thermal Management | Thermal resistance requires >0.5W/cm² heat dissipation design |
| Storage | Store in <10% relative humidity environment |
| Risk Warnings |
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Alternative Model Params
- Vdss (≤20V)
- RDS(on) (≤25mΩ)
- Continuous drain current (≥3A)
- Operating temperature (-55°C~+150°C)
- Gate threshold voltage (≤500mV)
Design Recommendations
| Layout | Maintain 3mm trace width for gate drive paths |
| Thermal | Implement copper pour for thermal relief |
| Compatibility | Verify gate driver IC compatibility with 500mV threshold |
| Testing | Perform JESD22-A114-A stress test for reliability |
Market Positioning
| Strengths |
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| Weaknesses |
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