IRF540NPBF
Manufacturer
Model
IRF540NPBF
Category
The OSEN IRF540NPBF is a high-current N-channel MOSFET designed for power switching applications requiring up to 33A continuous current and 100V switching voltage. With 35mΩ on-resistance and 130W power dissipation, it suits motor control, power supplies, and industrial automation systems. Critical design considerations include proper heat sinking, gate drive optimization, and thermal management. While cost-effective and widely available, its thermal performance at continuous full load and lack of integrated protection features represent key limitations for high-frequency or extreme thermal environments.
Reference Pricing
Reference Stock
Specifications
| Drain Current (Id) | 33A |
| Drain-Source Voltage (Vds) | 100V |
| Gate-Source Voltage (Vgs) | ±20V |
| On-Resistance (Rds(on)) | 35mΩ |
| Operating Temperature Range | -55℃ to 150℃ |
| Package Material | Plastic |
| Package Type | TO-220 |
| Rated Voltage | 100V |
| Switching Speed | {"Turn-On Delay Time (Td(on))": "40ns", "Rise Time (Tr)": "45ns", "Turn-Off Delay Time (Td(off))": "200ns", "Fall Time (Tf)": "65ns"} |
| Threshold Voltage (Vth) | 2.0V |
| Transconductance (gm) | 8S |
Function And Role
Core Function
N-channel power switching device for high-current applications
Key Characteristics
- 100V drain-source voltage
- 33A continuous drain current
- 35mΩ@10V on-resistance
- 130W power dissipation
- 2V gate threshold voltage
- TO-220 packaging
Application Domains
Basic Scenarios
- motor drive systems
- power supply units
- industrial automation
- power conversion circuits
Extended Scenarios
- renewable energy systems
- high-power LED arrays
- industrial motor controls
- automotive electrical systems
Precautions
| Soldering | Use 300-350°C soldering iron with 0.5-1.0mm tip, avoid prolonged heat exposure |
| Current Limit | Max continuous current 33A (100°C ambient), peak current 150A (10s duration) |
| Voltage Limit | Max Vds 100V, overvoltage protection required beyond 125V |
| Thermal Management | Critical heat dissipation requirement (130W), recommend 50W+ heat sink |
| Storage | Store in <10% RH environment, max temperature 85°C |
| Risk Warnings |
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Alternative Model Params
- Vdss ≥90V
- Idc ≥30A
- RDS(on) ≤40mΩ
- Pd ≥120W
- Vgs(th) ≤2.5V
Design Recommendations
| Layout | Maintain ≥3mm creepage distance in high-voltage sections |
| Thermal | Implement thermal vias under tab for PCB cooling |
| Compatibility | Optimize gate drive with 10-15V pulse width modulator |
| Testing | Perform 100% IR test at 25°C/85°C/125°C conditions |
Market Positioning
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| Weaknesses |
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