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IRF3205PBF

Model

IRF3205PBF

Category

semiconductor
transistors

The OSEN IRF3205PBF is a TO-220AB packaged N-channel MOSFET designed for high-power switching applications with 55V Vdss, 110A Idc, and 10mΩ RDS(on). It supports power systems in motor drives, inverters, and renewable energy systems requiring robust thermal management and cost-effective solutions. Proper heat sinking, gate drive optimization, and adherence to voltage/current limits are critical for reliable operation.

Reference Pricing

1+ :$0.3822
10+ :$0.301
50+ :$0.2954
100+ :$0.2254
500+ :$0.2352
1000+ :$0.21

Reference Stock

Available:1211

Specifications

Drain Current (Id)110A
Drain-Source Voltage (Vds)55V
Gate-Source Voltage (Vgs)±20V
On-Resistance (Rds(on))7mΩ
Operating Temperature Range–55°C to 150°C
Package MaterialPlastic
Package TypeTO-220AB
Rated Voltage55V
Switching Speed{"Turn-On Delay Time": "14ns", "Rise Time": "101ns", "Turn-Off Delay Time": "50ns", "Fall Time": "65ns"}
Threshold Voltage (Vth)2.0V
Transconductance (gm)44S

Function And Role

Core Function

N-channel MOSFET for power switching and amplification applications

Key Characteristics

  • 55V drain-source voltage
  • 110A continuous drain current
  • 10mΩ RDS(on) at 10V
  • 200W power dissipation
  • 4V gate threshold voltage

Application Domains

Basic Scenarios

  • motor control circuits
  • power supply regulation
  • inverter systems

Extended Scenarios

  • renewable energy conversion
  • electric vehicle power electronics
  • industrial automation equipment

Precautions

Soldering

Use high-temperature solder paste and avoid prolonged heating (>3 seconds per pad) to prevent package damage

Current Limit

Max continuous current: 110A; peak current: 220A (10ms pulse)

Voltage Limit

Max Vds: 55V; absolute maximum Vgs: ±20V

Thermal Management

Required heat sink for continuous operation; junction temperature <150°C

Storage

Store in <10% RH, <40°C environment for >12 months

Risk Warnings
  • ESD sensitive (±2000V)
  • Reverse bias protection required
  • Overvoltage protection for gate terminals

Alternative Model Params

  • Vdss ≥55V
  • Idc ≥110A
  • RDS(on) ≤12mΩ
  • Pd ≤200W
  • Vgs(th) 3.5-4.5V

Design Recommendations

Layout

Maintain <10mm gate trace length and use star grounding

Thermal

Calculate thermal resistance (Rθja) <15K/W with heat sink

Compatibility

Use gate driver with >10A peak current capability

Testing

Verify switching performance at 100% max current for 1000 cycles

Market Positioning

Strengths
  • High power density (200W in TO-220AB)
  • Industry-standard voltage/current ratings
  • Cost-effective for medium-power applications
Weaknesses
  • Moderate gate charge (146nC) limits high-frequency switching
  • Higher on-resistance compared to super-junction MOSFETs

Datasheet

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