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BSS214NW-HXY

Manufacturer

Heng Jiaxing

Model

BSS214NW-HXY

Category

semiconductor
transistors

The BSS214NW-HXY is a cost-effective N-channel MOSFET optimized for low-voltage switching in consumer electronics and automotive applications. With 20V/2A ratings and SOT-323 packaging, it provides reliable performance in compact designs while meeting ROHS requirements. Engineers should prioritize thermal management and soldering techniques to maximize reliability, particularly in continuous current applications.

Reference Pricing

10+ :$0.0588
100+ :$0.0532
300+ :$0.0476
3000+ :$0.035
6000+ :$0.0308
9000+ :$0.0364

Reference Stock

Available:2632

Specifications

Drain Current (Id)2A
Drain-Source Voltage (Vds)20V
Gate-Source Voltage (Vgs)±12V
On-Resistance (Rds(on))55mΩ@Vgs=4.5V, 85mΩ@Vgs=2.5V
Operating Temperature Range-55℃ to 150℃
Package MaterialNot provided
Package TypeSOT-323
Rated Voltage20V
Switching SpeedNot provided
Threshold Voltage (Vth)0.4V - 1.0V
Transconductance (gm)Not provided

Function And Role

Core Function

N-channel MOSFET for low-voltage switching applications

Key Characteristics

  • 20V drain-source voltage
  • 2A continuous drain current
  • SOT-323 packaging
  • ROHS compliant

Application Domains

Basic Scenarios

  • Low-power signal switching
  • Consumer electronics power management
  • DC-DC converter circuits

Extended Scenarios

  • Automotive electronic systems
  • Industrial motor control
  • Solar inverter modules

Precautions

Soldering

Use 60-80°C soldering iron with 0.5-1.2mm tip, 2-3 seconds per pin

Current Limit

Max continuous current 2A (peak 4A for 10ms)

Voltage Limit

Max Vds 20V, reverse bias breakdown voltage 40V

Thermal Management

Thermal resistance 50°C/W, require heat sink for >1A continuous operation

Storage

Store in <85% RH, <40°C environments in anti-static packaging

Risk Warnings
  • Static sensitive
  • Avoid soldering in high-altitude environments
  • Maximum junction temperature 150°C

Alternative Model Params

  • Vdss (20V±5%)
  • Id continuous (2A max)
  • RDS(on) <50mΩ (typical value)
  • Package size 2.9x2.1x1.0mm

Design Recommendations

Layout

Maintain 3mm creepage distance between pins

Thermal

Use thermal vias under drain pad for PCB designs

Compatibility

compatible with 0805 packaging resistors/capacitors

Testing

Verify RDS(on) with 4-wire Kelvin measurement

Market Positioning

Strengths
  • Cost-effective (unit price $0.04-0.07)
  • Compact SOT-323 packaging for space-constrained designs
  • Full ROHS compliance
Weaknesses
  • Limited to <2A continuous operation
  • No gate charge specifications
  • Lower thermal performance vs. TO-220 packaging

Datasheet

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