AO3400A
Manufacturer
Model
AO3400A
Category
The ChipNobo AO3400A is a ROHS compliant MOSFET packaged in SOT-23, designed for low-power electronic devices, supporting drain-source voltage of -20V to +20V and continuous current of 1.0A, suitable for power management modules in fields such as IoT and wearable devices. Pay attention to the thermal challenges brought by its miniaturized characteristics and it is recommended to use a dedicated thermal design. The product achieves fast delivery through optimized price gradient (minimum order quantity 20 pieces) and a global warehousing network, but external drive solutions need to be evaluated for high-frequency application scenarios.
Reference Pricing
Reference Stock
Specifications
Drain Current (Id) | 5.2A |
Drain-Source Voltage (Vds) | 30V |
Gate-Source Voltage (Vgs) | ±12V |
On-Resistance (Rds(on)) | 27mΩ |
Operating Temperature Range | -55 to 150℃ |
Package Material | Not specified in the provided document |
Package Type | SOT-23 |
Rated Voltage | 30V |
Switching Speed | {"Turn-On Delay Time (Td(on))": "2.6ns", "Turn-Off Delay Time (Td(off))": "21.2ns", "Rise Time": "41.8ns", "Fall Time (Tf)": "6.4ns"} |
Threshold Voltage (Vth) | 0.6mΩ V |
Transconductance (gm) | 19S |
Function And Role
Core Function
SOT-23 packaged MOSFET, suitable for low-power switching and power management circuits
Key Characteristics
- ROHS compliant
- Miniaturized packaging (SOT-23)
- Operating temperature range -40°C to +150°C
Application Domains
Basic Scenarios
- DC-DC converter
- Low-power transistor switch
- Battery management system
Extended Scenarios
- Power module for IoT devices
- Driver circuit for wearable devices
- Automotive electronic control unit
Precautions
Soldering | It is recommended to use reflow soldering (peak temperature ≤260°C, time ≤20 seconds) |
Current Limit | Maximum continuous current 1.0A (junction temperature <150°C) |
Voltage Limit | Drain-source voltage supports -20V to +20V |
Thermal Management | Thermal pad (area ≥8mm²) must be configured |
Storage | Store in an environment with temperature 10-50°C, humidity <30% |
Risk Warnings |
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Alternative Model Params
- Vds (drain-source voltage)
- Id (conduction current)
- PackageType (package type)
Design Recommendations
Layout | It is recommended to use a 4-layer PCB layout with a complete ground plane |
Thermal | Use thermal materials with a thermal resistance ≤20°C/W |
Compatibility | Compatible with most MOSFET driver ICs |
Testing | 1000-hour durability test is required |
Market Positioning
Strengths |
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Weaknesses |
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