BZT52C5V6
Manufacturer
Model
BZT52C5V6
Category
The TWGMC BZT52C5V6 is a compact SOD-123 packaged Zener diode optimized for 5.2V-6V voltage regulation and overvoltage protection. With 500mW power dissipation and 40Ω impedance, it suits low-power supply circuits and surge suppression. Key applications include voltage reference design and communication system protection. Engineers should ensure proper thermal management and observe soldering parameters to maintain reliability. The device offers cost efficiency for medium-volume production but has limited voltage range compared to higher-wattage alternatives.
Reference Pricing
Reference Stock
Specifications
| Maximum Power Dissipation | 400mW |
| Maximum Stable Current | 5mA |
| Operating Temperature Range | -55℃ to +150℃ |
| Package Type | SOD-123 |
| Rated Current | 5mA |
| Rated Voltage | 5.2V - 6.0V |
| Reverse Leakage Current | 1.0uA |
| Stabilized Voltage | 5.2V - 6.0V |
| Temperature Coefficient | Not provided |
Function And Role
Core Function
Voltage regulation and overvoltage protection
Key Characteristics
- Independent Type 5.2V~6V Zener diode
- 500mW power dissipation (Pd)
- 40Ω dynamic impedance
- Reverse leakage current (Ir) of 1uA @ 2V
- 5.6V nominal Zener voltage
Application Domains
Basic Scenarios
- Power supply voltage regulation
- Overvoltage protection in low-voltage circuits
Extended Scenarios
- Voltage reference in analog circuits
- Surge suppression in communication systems
- Temperature compensation circuits
Precautions
| Soldering | Use 0.2-0.5mm solder paste and 300°C reflow soldering |
| Current Limit | Max continuous current 10mA (derating beyond 10°C) |
| Voltage Limit | Operating voltage range 5.2V-6V |
| Thermal Management | Thermal resistance 50°C/W, require heatsink for >500mW |
| Storage | Store in <10% RH, 5-40°C environment |
| Risk Warnings |
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Alternative Model Params
- Zener voltage tolerance ±5% (5.2V-6V)
- Power dissipation 300-700mW range
- Encapsulation SOD-123/SMA equivalent
- Max reverse voltage 50V
Design Recommendations
| Layout | Keep pad-to-pad spacing >1.5mm for thermal relief |
| Thermal | Use 2mm thick copper pour for heat dissipation |
| Compatibility | compatible with 0805/1206 footprint alternatives |
| Testing | Verify Zener breakdown voltage at 100% RH |
Market Positioning
| Strengths |
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| Weaknesses |
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