CUS10S30,H3F
Manufacturer
Model
CUS10S30,H3F
Category
FUXINSEMI CUS10S30,H3F provides reliable Schottky diode performance in SOD-323 package with low forward voltage and high efficiency, suitable for power conversion and protection in consumer electronics and renewable energy systems. Optimal for applications requiring 1A continuous current with proper thermal management, offering cost-effective solutions in moderate voltage environments.
Reference Pricing
Reference Stock
Specifications
Forward Voltage Drop | 0.41V |
Maximum Forward Current | 2A |
Maximum Reverse Voltage | 40V |
Operating Temperature Range | -40~+125℃ |
Package Type | SOD-323 |
Rated Current | Not specified |
Rated Voltage | Not specified |
Reverse Leakage Current | 50μA |
Switching Speed | Not specified |
Function And Role
Core Function
Rectification and low forward voltage drop Schottky diode for efficient power conversion
Key Characteristics
- SOD-323 package
- Low power loss
- ROHS compliant
- High switching speed
Application Domains
Basic Scenarios
- Power supply regulation
- DC-DC converter protection
- Signal switching circuits
Extended Scenarios
- Solar inverter systems
- Electric vehicle battery management
- High-frequency switching applications
Precautions
Soldering | Use 260-280℃ soldering iron with 0.5-1.2mm diameter tip, avoid prolonged heating |
Current Limit | Max continuous current 1A (10A peak), derate above 70℃ |
Voltage Limit | Max reverse voltage 20V, 40V peak |
Thermal Management | Thermal resistance 50℃/W, require 10x10mm copper pad |
Storage | Store in <10% RH, 10-40℃ environment in anti-static packaging |
Risk Warnings |
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Alternative Model Params
- Vf (forward voltage) <0.35V
- Ir (reverse current) <10μA
- Pd (power dissipation) <0.5W
Design Recommendations
Layout | Maintain 1mm trace width for power paths, use via-in-pad for thermal relief |
Thermal | Implement 3x3mm copper pour under die, consider thermal vias |
Compatibility | Verify with 6-36V DC systems, avoid parallel connection without snubber circuit |
Testing | 100% ESD testing required, perform 500℃/24hr thermal cycle test |
Market Positioning
Strengths |
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Weaknesses |
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