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CUS10S30,H3F

Manufacturer

Xiaomi

Model

CUS10S30,H3F

Category

semiconductor
diodes

FUXINSEMI CUS10S30,H3F provides reliable Schottky diode performance in SOD-323 package with low forward voltage and high efficiency, suitable for power conversion and protection in consumer electronics and renewable energy systems. Optimal for applications requiring 1A continuous current with proper thermal management, offering cost-effective solutions in moderate voltage environments.

Reference Pricing

20+ :$0.0308
200+ :$0.028
600+ :$0.028

Reference Stock

Available:3779

Specifications

Forward Voltage Drop0.41V
Maximum Forward Current2A
Maximum Reverse Voltage40V
Operating Temperature Range-40~+125℃
Package TypeSOD-323
Rated CurrentNot specified
Rated VoltageNot specified
Reverse Leakage Current50μA
Switching SpeedNot specified

Function And Role

Core Function

Rectification and low forward voltage drop Schottky diode for efficient power conversion

Key Characteristics

  • SOD-323 package
  • Low power loss
  • ROHS compliant
  • High switching speed

Application Domains

Basic Scenarios

  • Power supply regulation
  • DC-DC converter protection
  • Signal switching circuits

Extended Scenarios

  • Solar inverter systems
  • Electric vehicle battery management
  • High-frequency switching applications

Precautions

Soldering

Use 260-280℃ soldering iron with 0.5-1.2mm diameter tip, avoid prolonged heating

Current Limit

Max continuous current 1A (10A peak), derate above 70℃

Voltage Limit

Max reverse voltage 20V, 40V peak

Thermal Management

Thermal resistance 50℃/W, require 10x10mm copper pad

Storage

Store in <10% RH, 10-40℃ environment in anti-static packaging

Risk Warnings
  • Static discharge hazard
  • Exceed voltage/current ratings cause thermal runaway

Alternative Model Params

  • Vf (forward voltage) <0.35V
  • Ir (reverse current) <10μA
  • Pd (power dissipation) <0.5W

Design Recommendations

Layout

Maintain 1mm trace width for power paths, use via-in-pad for thermal relief

Thermal

Implement 3x3mm copper pour under die, consider thermal vias

Compatibility

Verify with 6-36V DC systems, avoid parallel connection without snubber circuit

Testing

100% ESD testing required, perform 500℃/24hr thermal cycle test

Market Positioning

Strengths
  • Cost-per-watt efficiency
  • High stock availability (9300 pieces)
  • 20+ purchase quantity discount
Weaknesses
  • Limited to <20V applications
  • No industrial temperature grade option
  • Lower peak current handling vs competitors

Datasheet

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