SS34
Manufacturer
Model
SS34
Category
The TWGMC SS34 Schottky diode offers efficient rectification with a 3A continuous current rating and 550mV forward voltage drop at full load, making it suitable for power supply and motor control applications. Its 40V reverse voltage rating and 500µA leakage current provide reliable performance in industrial and renewable energy systems. Designers should prioritize thermal management and ensure proper soldering practices to maximize device lifespan.
Reference Pricing
Reference Stock
Specifications
Forward Voltage Drop | 0.55V |
Maximum Forward Current | 3A |
Maximum Reverse Voltage | 40V |
Operating Temperature Range | -65 to +125℃ |
Package Type | SMC |
Rated Current | 3A |
Rated Voltage | 28V |
Reverse Leakage Current | 1.5mA |
Switching Speed | Not specified |
Function And Role
Core Function
Rectification and signal switching
Key Characteristics
- Low forward voltage drop (550mV@3A)
- Independent type configuration for parallel operation
- High efficiency in power conversion
- Reverse leakage current of 500µA
Application Domains
Basic Scenarios
- DC-DC power supply circuits
- Motor drive systems
- Power factor correction (PFC) modules
- Low noise signal switching
Extended Scenarios
- Renewable energy systems (solar inverters)
- High-frequency switching applications
- Electric vehicle battery management
- Industrial motor control
Precautions
Soldering | Maintain soldering temperature below 260°C and time <5 seconds |
Current Limit | Max continuous current 3A (10A peak) |
Voltage Limit | Max DC reverse voltage 40V |
Thermal Management | Thermal resistance 35°C/W, require heat dissipation >1W |
Storage | Store in <10% RH, <40°C environment |
Risk Warnings |
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Alternative Model Params
- Reverse voltage (Vr): 30-50V
- Forward current (If): 2-5A
- Forward voltage (Vf): <600mV
- Leakage current (Ir): <1mA
- Thermal resistance (RθJA): <40°C/W
Design Recommendations
Layout | Use star grounding and keep trace length <10mm |
Thermal | Implement thermal vias (1.5mm pitch) for high-power sections |
Compatibility | Ensure footprint matches 5.3x5.3mm SMC packages |
Testing | Verify reverse recovery time <50ns under 100% load |
Market Positioning
Strengths |
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Weaknesses |
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