RFX2401C
Manufacturer
Model
RFX2401C
Category
The RFX2401C is a compact 2.4-2.5GHz RF front-end module optimized for low-power IoT devices, featuring integrated LNA and switch in a 3x3mm QFN package. Its 20dB gain and 1.8-3.6V supply flexibility make it suitable for Wi-Fi/Bluetooth applications requiring minimal board space and power consumption.
Reference Pricing
Reference Stock
Specifications
| Dimensions | 3x3x0.55mm |
| Frequency Range | 2.4GHz - 2.525GHz |
| Gain | 25dB (typical) |
| Linearity | Meets standards for OQPSK modulation |
| Noise Coefficient | Not provided |
| Noise Figure | 2.5dB (typical) |
| Operating Temperature | Operating temperature range: -40°C to +85°C |
| Operating Temperature Range | Operating temperature range: -40°C to +85°C |
| Package Material | Sn-PbEutecticAssembly or Pb-FreeAssembly |
| Package Type | QFN-16-EP(3x3) |
| Power Consumption | Very low |
| Power Dissipation | 7 mW max |
| Rated Voltage | 1.2V - 3.6V |
Function And Role
Core Function
2.4GHz-2.5GHz RF front-end circuit for wireless signal transmission/reception
Key Characteristics
- QFN-16-EP(3x3) package
- ROHS compliant
- integrated LNA and switch
- low power consumption
Application Domains
Basic Scenarios
- Wi-Fi enabled consumer electronics
- Bluetooth-enabled IoT devices
- wireless sensor networks
Extended Scenarios
- smart home automation systems
- industrial wireless monitoring equipment
- low-power wireless audio transmitters
Precautions
| Soldering | Use fine tip soldering iron (≤3W) and 340℃ reflow profile for QFN package |
| Current Limit | Max DC input current: 150mA (absolute maximum) |
| Voltage Limit | Supply voltage range: 1.8V-3.6V |
| Thermal Management | Thermal resistance: 16.5°C/W ( junction-to-ambient ) |
| Storage | Store in desiccated environments below 10% RH |
| Risk Warnings |
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Alternative Model Params
- Frequency range (2.4-2.5GHz)
- Supply voltage (1.8-3.6V)
- Package type (QFN-16-EP)
- Power consumption (<50mA @ 3.3V)
Design Recommendations
| Layout | Maintain 10mil clearance between RF paths and power planes |
| Thermal | Use thermal vias under package corners for heat dissipation |
| Compatibility | Verify with 0.8mm pitch reference designs |
| Testing | Perform 3V AC RF signal testing at 3dB gain point |
Market Positioning
| Strengths |
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| Weaknesses |
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Datasheet
Assist inquiry
Distributors
Shenzhen Bestone Electronics Co., Ltd.
Shenzhen Binxing Microelectronics Co., Ltd.
Shenzhen Chenghan Electronics Co., Ltd.
Shenzhen Chuanghai Shengye Electronic Co., Ltd.
Shenzhen Futian District Jinkelai Electronic Commerce
Dexin Technology (Shenzhen) Co., Ltd.
Shenzhen Dongli Technology Co., Ltd.
Shenzhen Dalwei Semiconductor Co., Ltd.
Shenzhen Jinbo Electronics Co., Ltd.
Shenzhen Futian District Huafang Tonda Electronics Trading Co., Ltd.
Shenzhen Huachuangxin Microelectronics Technology Co., Ltd.
Shenzhen Feiyi Xinneng Technology Co., Ltd.
Shenzhen Huapeng Electronic Trading (Individual)
Shenzhen Huatai Hengxin Electronics Co., Ltd.
Shenzhen Huilitong Technology Co., Ltd.
Shenzhen Huaxinwei Technology Co., Ltd.
Shenzhen Atsilicon Technology Co., Ltd.
Jing He Sheng Technology (Shenzhen) Co., Ltd.
Shenzhen Golden Palm Semiconductor Co., Ltd.
Shenzhen Jieshangda Electronic Co., Ltd.
Shenzhen Jinyuanyuan Electronic Co., Ltd.
Shenzhen Jinweili Weiyi Technology Co., Ltd.
Shenzhen Futian District Lanboer Electronic Trading Company
OBAOTE Technology (Hong Kong) Limited
Shenzhen Ruixin Intelligent Electronic Co., Ltd.
Xiamen Derui Electronics Technology Co., Ltd.
Shenzhen Senlan Microelectronics Co., Ltd.
Shenzhen Shunxingda Electronics Co., Ltd.
Shenzhen Bohuixin Electronic Co., Ltd.
Shenzhen Tengen Technology Co., Ltd.