BWSMA-KWE-Z001
Manufacturer
Model
BWSMA-KWE-Z001
Category
The BWSMA-KWE-Z001 is a cost-effective SMA board-end elbow connector optimized for 50Ω RF systems, offering reliable signal transmission in industrial communication infrastructure. Its compact 5.3mm interface suits space-constrained applications while maintaining impedance matching accuracy. Critical design considerations include soldering techniques, thermal management, and mechanical stress avoidance to ensure longevity in high-frequency environments.
Reference Pricing
Reference Stock
Specifications
| Contact Resistance | Inner Conductor <3mΩ, Outer Conductor <2mΩ |
| Dimensions | PLUG Inner Diameter/JACK Outer Diameter 6.5mm/5.4mm |
| Frequency Range | 0-12.4G (Soft Cable) |
| Insertion Loss | 0.15dB (6GHz) |
| Insulation Resistance | >5000 Megohms |
| Interface Type | SMA |
| Operating Temperature Range | -65~+165°C (PE Cable -40~+85°C) |
| Return Loss | Straight Soft Cable <1.15+0.02f GF |
| Temperature Coefficient | N/A |
| VSWR | Straight Soft Cable <1.15+0.02f GF |
| Weight | None |
| Withstand Voltage | 1000Vrms |
Function And Role
Core Function
RF signal transmission and connection in coaxial systems
Key Characteristics
- 50Ω impedance matching
- 5.3mm inner interface diameter
- SMA board-end elbow design
- ROHS compliant
Application Domains
Basic Scenarios
- RF test equipment
- base station infrastructure
- satellite communication systems
Extended Scenarios
- 5G small cell deployments
- antenna array integration
- automotive radar systems
Precautions
| Soldering | Use high-temperature solder paste (300-350°C) and avoid prolonged heat exposure |
| Current Limit | Max continuous current 0.5A (derate to 0.25A for high-frequency applications) |
| Voltage Limit | Operating voltage -50V to +2500V DC |
| Thermal Management | Operating temperature -65°C to +165°C |
| Storage | Store in dry environment below 85% relative humidity |
| Risk Warnings |
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Alternative Model Params
- Frequency range (DC-18GHz)
- Impedance tolerance (±0.1Ω)
- Interface diameter (5.3±0.05mm)
- Operating temperature range
Design Recommendations
| Layout | Maintain 3mm minimum trace spacing on PCB |
| Thermal | Use 0.5mm thickness copper for heat dissipation |
| Compatibility | Ensure PCB pad dimensions match 5.3mm diameter |
| Testing | Perform 100% visual inspection before assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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